Resolving the Thermal Labyrinth inside 3D-IC Stacks
Researchers present a method for three-dimensional thermal characterization of advanced 3D integrated circuits. The workflow extracts thermal properties by layer and builds a location-specific database to examine how heat moves through a stack.
Researchers present a method for three-dimensional thermal characterization of advanced 3D integrated circuits. The workflow extracts thermal properties by layer and builds a location-specific database to examine how heat moves through a stack.
They demonstrate the method on a sample with 2.2-micrometre through-silicon vias and about 2-micrometre-pitch face-to-face hybrid bonding. The preprint describes measurement research relevant to chip thermal management, not a production-ready cooling system.
At the BUILD 2026 conference, the communications minister cited power, connectivity, cloud access and advanced chips as constraints on local AI growth.
Source: Voice of Nigeria, reporting the Ministry of Communications, Innovation and Digital Economy
Researchers from Ottawa, Columbia and Hanyang reviewed post-CMOS materials and device approaches for artificial neurons; the work is a literature review, not a new chip prototype.
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