NTT-led Japanese group develops optical chiplet production methods for AI systems
NTT, NTT Innovative Devices, Japan Semiconductor, Furukawa Electric and Shinko Electric said a proposal led by NTT Innovative Devices was selected for a Japanese NEDO advanced-semiconductor programme. The project will develop manufacturing, testing and packaging methods for optical chiplets used to connect processors with light.
NTT, NTT Innovative Devices, Japan Semiconductor, Furukawa Electric and Shinko Electric said a proposal led by NTT Innovative Devices was selected for a Japanese NEDO advanced-semiconductor programme. The project will develop manufacturing, testing and packaging methods for optical chiplets used to connect processors with light.
The group plans to establish and evaluate a pilot production line, targeting manufacturing productivity more than ten times that of current research-stage processes. The announcement describes a development target; it does not report a completed production line or commercial output.
At the BUILD 2026 conference, the communications minister cited power, connectivity, cloud access and advanced chips as constraints on local AI growth.
Source: Voice of Nigeria, reporting the Ministry of Communications, Innovation and Digital Economy
Researchers from Ottawa, Columbia and Hanyang reviewed post-CMOS materials and device approaches for artificial neurons; the work is a literature review, not a new chip prototype.
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