{"version":"1","article":{"id":"thermal-characterization-3d-ic-stacks-2026","slug":"thermal-characterization-3d-ic-stacks-2026","language":"en","url":"https://haberpaper.com/en/news/thermal-characterization-3d-ic-stacks-2026","api_url":"https://haberpaper.com/api/v1/articles/thermal-characterization-3d-ic-stacks-2026?lang=en","title":"Resolving the Thermal Labyrinth inside 3D-IC Stacks","summary":"Researchers present a method for three-dimensional thermal characterization of advanced 3D integrated circuits. The workflow extracts thermal properties by layer and builds a location-specific database to examine how heat moves through a stack.","category":"business","region":"world","topics":["ai","semiconductors"],"published_at":"2026-10-20T19:09:32+03:00","modified_at":"2026-10-20T19:09:32+03:00","publication_basis":"publication-record","event_period":"2026-10-19","event_period_basis":"event-or-reference-period","sources":[{"name":"arXiv","url":"https://arxiv.org/abs/2610.26647v1","publishedAt":"2026-10-19","checkedAt":"2026-10-20"}],"translations":[{"language":"tr","url":"https://haberpaper.com/tr/news/thermal-characterization-3d-ic-stacks-2026","api_url":"https://haberpaper.com/api/v1/articles/thermal-characterization-3d-ic-stacks-2026?lang=tr"},{"language":"en","url":"https://haberpaper.com/en/news/thermal-characterization-3d-ic-stacks-2026","api_url":"https://haberpaper.com/api/v1/articles/thermal-characterization-3d-ic-stacks-2026?lang=en"},{"language":"ar","url":"https://haberpaper.com/ar/news/thermal-characterization-3d-ic-stacks-2026","api_url":"https://haberpaper.com/api/v1/articles/thermal-characterization-3d-ic-stacks-2026?lang=ar"},{"language":"fr","url":"https://haberpaper.com/fr/news/thermal-characterization-3d-ic-stacks-2026","api_url":"https://haberpaper.com/api/v1/articles/thermal-characterization-3d-ic-stacks-2026?lang=fr"},{"language":"es","url":"https://haberpaper.com/es/news/thermal-characterization-3d-ic-stacks-2026","api_url":"https://haberpaper.com/api/v1/articles/thermal-characterization-3d-ic-stacks-2026?lang=es"}],"data_types":[],"data":null,"data_compilations":[],"data_downloads":[],"content":{"paragraphs":["Researchers present a method for three-dimensional thermal characterization of advanced 3D integrated circuits. The workflow extracts thermal properties by layer and builds a location-specific database to examine how heat moves through a stack.","They demonstrate the method on a sample with 2.2-micrometre through-silicon vias and about 2-micrometre-pitch face-to-face hybrid bonding. The preprint describes measurement research relevant to chip thermal management, not a production-ready cooling system."],"key_points":[],"sections":[]},"text":"Researchers present a method for three-dimensional thermal characterization of advanced 3D integrated circuits. The workflow extracts thermal properties by layer and builds a location-specific database to examine how heat moves through a stack.\n\nResearchers present a method for three-dimensional thermal characterization of advanced 3D integrated circuits. The workflow extracts thermal properties by layer and builds a location-specific database to examine how heat moves through a stack.\n\nThey demonstrate the method on a sample with 2.2-micrometre through-silicon vias and about 2-micrometre-pitch face-to-face hybrid bonding. The preprint describes measurement research relevant to chip thermal management, not a production-ready cooling system.","corrections":[],"editorial_illustration":{"kind":"symbolic-editorial-illustration","documentary":false,"scope":"section","asset_id":"business","url":"https://haberpaper.com/assets/illustrations/business-1536.webp","width":1536,"height":1024,"alt":"Symbolic industrial workshop with machinery, a warehouse and a crane.","language":"en"},"section_illustration":{"kind":"symbolic-editorial-illustration","documentary":false,"scope":"section","asset_id":"business","url":"https://haberpaper.com/assets/illustrations/business-1536.webp","width":1536,"height":1024,"alt":"Symbolic industrial workshop with machinery, a warehouse and a crane.","language":"en"}}}