{"version":"1","article":{"id":"amd-versal-ai-core-space-grade-sampling-2026","slug":"amd-versal-ai-core-space-grade-sampling-2026","language":"en","url":"https://haberpaper.com/en/news/amd-versal-ai-core-space-grade-sampling-2026","api_url":"https://haberpaper.com/api/v1/articles/amd-versal-ai-core-space-grade-sampling-2026?lang=en","title":"AMD begins sampling Versal AI Core chips in an enhanced space-grade package","summary":"XQRVC1902 samples are with early-access customers. Class Y flight qualification remains in testing; flight-qualified units are expected in the second half of 2027.","category":"business","region":"world","topics":[],"published_at":"2026-10-08T01:26:48+03:00","modified_at":"2026-10-08T01:26:48+03:00","publication_basis":"publication-record","event_period":"2026-10-01","event_period_basis":"event-or-reference-period","sources":[{"name":"AMD Newsroom","url":"https://newsroom.amd.com/news/amd-sampling-versal-ai-core-adaptive-soc/","publishedAt":"2026-10-01","checkedAt":"2026-10-08"}],"translations":[{"language":"tr","url":"https://haberpaper.com/tr/news/amd-versal-ai-core-space-grade-sampling-2026","api_url":"https://haberpaper.com/api/v1/articles/amd-versal-ai-core-space-grade-sampling-2026?lang=tr"},{"language":"en","url":"https://haberpaper.com/en/news/amd-versal-ai-core-space-grade-sampling-2026","api_url":"https://haberpaper.com/api/v1/articles/amd-versal-ai-core-space-grade-sampling-2026?lang=en"},{"language":"ar","url":"https://haberpaper.com/ar/news/amd-versal-ai-core-space-grade-sampling-2026","api_url":"https://haberpaper.com/api/v1/articles/amd-versal-ai-core-space-grade-sampling-2026?lang=ar"},{"language":"fr","url":"https://haberpaper.com/fr/news/amd-versal-ai-core-space-grade-sampling-2026","api_url":"https://haberpaper.com/api/v1/articles/amd-versal-ai-core-space-grade-sampling-2026?lang=fr"},{"language":"es","url":"https://haberpaper.com/es/news/amd-versal-ai-core-space-grade-sampling-2026","api_url":"https://haberpaper.com/api/v1/articles/amd-versal-ai-core-space-grade-sampling-2026?lang=es"}],"data_types":["table"],"data":{"version":1,"blocks":[{"id":"qualification-stages","type":"table","title":{"tr":"Uzay sınıfı yonga yeterlilik aşamaları","en":"Space-grade chip qualification stages","ar":"مراحل تأهيل الشريحة الفضائية","fr":"Étapes de qualification du composant spatial","es":"Etapas de calificación del componente espacial"},"description":{"tr":"AMD'nin duyurduğu örnekleme, yeterlilik ve kullanım süresi açıklamaları.","en":"AMD statements on sampling, qualification and mission duration.","ar":"تصريحات AMD حول العينات والتأهيل ومدة المهمة.","fr":"Déclarations d’AMD sur l’échantillonnage, la qualification et la durée des missions.","es":"Declaraciones de AMD sobre muestras, calificación y duración de misiones."},"methodology":{"tr":"Değerler şirket duyurusundan aktarılır; Class Y yeterliliği tamamlanmamıştı ve 2027 dönemi beklentidir.","en":"Values are from the company announcement; Class Y qualification was incomplete and the 2027 timing is expected.","ar":"القيم من إعلان الشركة؛ لم يكتمل تأهيل Class Y وتوقيت 2027 متوقع.","fr":"Valeurs du communiqué; la qualification Class Y était inachevée et le calendrier 2027 est prévu.","es":"Valores del anuncio empresarial; Class Y seguía pendiente y el calendario de 2027 es previsto."},"sourceUrls":["https://newsroom.amd.com/news/amd-sampling-versal-ai-core-adaptive-soc/"],"updatedAt":"2026-10-08T00:34:50+03:00","columns":[{"key":"stage","label":{"tr":"Aşama","en":"Stage","ar":"المرحلة","fr":"Étape","es":"Etapa"},"type":"text","language":"en"},{"key":"company_statement","label":{"tr":"Şirket açıklaması","en":"Company statement","ar":"تصريح الشركة","fr":"Déclaration de l’entreprise","es":"Declaración de la empresa"},"type":"text","language":"en"}],"rows":[{"stage":"Customer sampling","company_statement":"Under way with early-access customers"},{"stage":"Class Y qualification","company_statement":"Testing in progress as of October 1, 2026"},{"stage":"Flight-qualified availability","company_statement":"Expected in the second half of 2027"},{"stage":"Designed mission duration","company_statement":"Up to 15 years"}]}]},"data_compilations":[{"id":"qualification-stages","creator":{"@type":"Organization","@id":"https://haberpaper.com/#organization","name":"Haber Paper","url":"https://haberpaper.com/"},"license":{"@type":"CreativeWork","@id":"https://haberpaper.com/en/data-terms/v1#license","name":"Haber Paper Original Data Compilation License 1.0","url":"https://haberpaper.com/en/data-terms/v1"},"rights_scope":"Haber Paper original data arrangement, labels and methodology notes only; underlying source rights and permissions remain separate.","source_license_url":null}],"data_downloads":[{"id":"qualification-stages","formats":{"json":"https://haberpaper.com/api/v1/articles/amd-versal-ai-core-space-grade-sampling-2026/data/qualification-stages?lang=en&format=json","csv":"https://haberpaper.com/api/v1/articles/amd-versal-ai-core-space-grade-sampling-2026/data/qualification-stages?lang=en&format=csv"}}],"content":{"paragraphs":["AMD said on October 1 it had begun sampling its Versal AI Core XQRVC1902 adaptive system-on-chip in an enhanced space-grade package with early-access customers. The company says the package is designed for space missions lasting up to 15 years. Sampling lets customers build engineering models; it does not mean the product has reached final flight-qualified status.","AMD says the device is being tested to the U.S. military specification MIL-PRF-38535 Class Y. The company describes Class Y as the standard’s highest quality and reliability level for spaceflight components. Qualification was not complete when the announcement was published. AMD expects Class Y flight-qualified units to become available in the second half of 2027. That is an expected window, not a precise delivery date or customer-order schedule.","The new package uses a lidless organic design and enhanced organic substrate. AMD says these materials are intended to mitigate thermal and mechanical stress in space, and that the package incorporates space-grade chip capacitors with flight heritage. The company says the lidless design improves thermal performance and supports in-orbit processing for payloads. These are supplier statements; the release does not provide independent measured performance data.","AMD positions the device for human-rated, long-duration and other high-value missions, including geosynchronous Earth orbit, cislunar orbit, heliocentric orbit and deep-space missions. Its programmable logic and in-orbit processing capabilities are design objectives for those uses, not evidence of deployment on such missions. Space electronics also depend on system-level validation, radiation tolerance and mission design, alongside chip specifications.","The package is described as pin-compatible with existing commercial, defense-grade and space-grade AMD Versal AI Core VC1902 devices in a 2,197-ball grid array. Pin compatibility may ease transition from existing board designs, but it does not establish drop-in operation or compliance with every mission requirement. Designers still need to complete power, thermal, software, qualification and mission-reliability tests.","AMD says samples are currently going to early-access customers and the product is described in its DS946 datasheet. Commercial samples, engineering models and Class Y flight-qualified devices are separate stages. The release gives no customer count, pricing, sales volume or revenue forecast. Commercial impact depends on whether sampling progresses into qualification and programme adoption; neither is yet a completed outcome."],"key_points":[],"sections":[]},"text":"XQRVC1902 samples are with early-access customers. Class Y flight qualification remains in testing; flight-qualified units are expected in the second half of 2027.\n\nAMD said on October 1 it had begun sampling its Versal AI Core XQRVC1902 adaptive system-on-chip in an enhanced space-grade package with early-access customers. The company says the package is designed for space missions lasting up to 15 years. Sampling lets customers build engineering models; it does not mean the product has reached final flight-qualified status.\n\nAMD says the device is being tested to the U.S. military specification MIL-PRF-38535 Class Y. The company describes Class Y as the standard’s highest quality and reliability level for spaceflight components. Qualification was not complete when the announcement was published. AMD expects Class Y flight-qualified units to become available in the second half of 2027. That is an expected window, not a precise delivery date or customer-order schedule.\n\nThe new package uses a lidless organic design and enhanced organic substrate. AMD says these materials are intended to mitigate thermal and mechanical stress in space, and that the package incorporates space-grade chip capacitors with flight heritage. The company says the lidless design improves thermal performance and supports in-orbit processing for payloads. These are supplier statements; the release does not provide independent measured performance data.\n\nAMD positions the device for human-rated, long-duration and other high-value missions, including geosynchronous Earth orbit, cislunar orbit, heliocentric orbit and deep-space missions. Its programmable logic and in-orbit processing capabilities are design objectives for those uses, not evidence of deployment on such missions. Space electronics also depend on system-level validation, radiation tolerance and mission design, alongside chip specifications.\n\nThe package is described as pin-compatible with existing commercial, defense-grade and space-grade AMD Versal AI Core VC1902 devices in a 2,197-ball grid array. Pin compatibility may ease transition from existing board designs, but it does not establish drop-in operation or compliance with every mission requirement. Designers still need to complete power, thermal, software, qualification and mission-reliability tests.\n\nAMD says samples are currently going to early-access customers and the product is described in its DS946 datasheet. Commercial samples, engineering models and Class Y flight-qualified devices are separate stages. The release gives no customer count, pricing, sales volume or revenue forecast. Commercial impact depends on whether sampling progresses into qualification and programme adoption; neither is yet a completed outcome.","corrections":[],"editorial_illustration":{"kind":"symbolic-editorial-illustration","documentary":false,"scope":"section","asset_id":"business","url":"https://haberpaper.com/assets/illustrations/business-1536.webp","width":1536,"height":1024,"alt":"Symbolic industrial workshop with machinery, a warehouse and a crane.","language":"en"},"section_illustration":{"kind":"symbolic-editorial-illustration","documentary":false,"scope":"section","asset_id":"business","url":"https://haberpaper.com/assets/illustrations/business-1536.webp","width":1536,"height":1024,"alt":"Symbolic industrial workshop with machinery, a warehouse and a crane.","language":"en"}}}